Anuncio de la Convocatoria ECSEL JU 2020

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ECSEL Joint Undertaking es una empresa común público-privada  que financia investigación, desarrollo e innovación en Sistemas y Componentes Electrónicos (ECS) como tecnologías clave para la era de la economía digital y de acuerdo a la normativa que lo estableció (COUNCIL REGULATION (EU) No 561/2014 of 6 May 2014 establishing the ECSEL Joint Undertaking).

Asociaciones industriales, estados miembros y la Comisión Europea forman ECSEL JU.  ECSEL JU financia proyectos de investigación, desarrollo e innovación que incluyen ECS a través de convocatorias anuales de proyectos transnacionales.

Se encuentra abierta la convocatoria 2020 (https://www.ecsel.eu/calls/calls-2020). Esta convocatoria incluye dos tipos de instrumentos:

  • Acciones de innovación H2020-ECSEL-2020-1-IA-two-stage (ECSEL-IA).
  • Acciones de investigación e innovación H2020-ECSEL-2020-2-RIA-two-stage – (ECSEL-RIA).

Además de la financiación directa de ECSEL JU (2020-1-IA 93M€ y 2020-2-RIA 61M€), la Agencia Estatal de Investigación (AEI) y el Ministerio de Asuntos Económicos y Transformación Digital (MINAETD) financian entidades públicas y privadas españolas con presupuestos de 1,3M€ y 10M€ respectivamente.

ECSEL JU promueve ECS como tecnologías críticas básicas en un amplísimo rango de áreas y financia proyectos de gran envergadura en lo que se refiere a consorcios y presupuestos. Pueden ver debajo las áreas y objetivos de la convocatoria abierta.

Topics and Major Challenges

Transport & Smart Mobility
  • Major Challenge 1: Developing clean, affordable and sustainable propulsion .
  • Major Challenge 2: Ensuring secure connected, cooperative and automated mobility and transportation.
  • Major Challenge 3: Managing interaction between humans and vehicles.
  • Major Challenge 4: Implementing infrastructure and services for smart personal mobility and logistics.
Health and Wellbeing
  • Moving healthcare from hospitals into our homes and daily life requiring preventive and patient centric care.
  • Restructuring healthcare delivery systems, from supply-driven to patient oriented.
  • Engaging individuals more actively in their own health and wellbeing.
  • Ensuring affordable healthcare for the growing amount of chronic, lifestyle related diseases and an ageing population.
  • Developing platforms for wearables/implants, data analytics, artificial intelligence for precision medicine and personalised healthcare and wellbeing.
Energy
  • Major Challenge 3: Secure, safe and trustable connectivity and infrastructure.
  • Major Challenge 4: Privacy, data protection and human interaction.
Digital Industry
  • Major Challenge 1: Developing digital twins, simulation models for the evaluation of industrial assets at all factory levels and over system or product life-cycles.
  • Major Challenge 2: AI-enabled cognitive, resilient, adaptable manufacturing.
  • Major challenge 3: Developing digital platforms, application development frameworks that integrate sensors/actuators and systems.
  • Major Challenge 4: Human-centred manufacturing.
  • Major Challenge 5: Sustainable manufacturing in a circular economy.
Digital Life
  • Major Challenge 1: Ensuring safe and secure spaces.
  • Major Challenge 2: Ensuring healthy and comfortable spaces.
  • Major Challenge 3: Ensuring anticipating spaces.
  • Major Challenge 4: Ensuring sustainable spaces.
Systems and Components: Architecture, Design and Integration
  • Major Challenge 1: Managing critical, autonomous, cooperating, evolvable systems.
  • Major Challenge 2: Managing Complexity.
  • Major Challenge 3: Managing Diversity.
  • Major Challenge 4: Managing Multiple Constraint.
  • Major Challenge 5: Integrating features of various technologies and materials into miniaturised smart components.
  • Major Challenge 6: Effectively integrating modules for highly demanding environments.
  • Major Challenge 7: Increasing compactness and capabilities by functional and physical systems integration.
Connectivity and Interoperability
  • Major Challenge 1: Strengthening the EU position on differentiated technologies and enabling it to capture higher value by moving to system/module level.
  • Major Challenge 2: Autonomous interoperability translation for communication protocol, data encoding, security and information semantics.
  • Major Challenge 3: Architectures and reference implementations of interoperable, secure, scalable, smart and evolvable IoT and SoS connectivity.
Safety, Security and Reliability
  • Major Challenge 1: Safety, security and privacy by design.
  • Major Challenge 2: Reliability and Functional Safety.
  • Major Challenge 3: Secure, safe and trustable connectivity and infrastructure.
  • Major Challenge 4: Privacy, data protection and human interaction.
Computing and Storage
  • Increasing performance at acceptable costs.
  • Making computing systems more integrated with the real world.
  • Making “intelligent” machines.
  • Developing new disruptive technologies.
Process Technology, Equipment, Materials and Manufacturing for Electronic Components & Systems
  • Major Challenge 1: Develop advanced logic and memory technology for nanoscale integration and application-driven performance.
  • Major Challenge 2: Develop Technology for Heterogeneous System-on-Chip (SoC) Integration.
  • Major Challenge 3: Develop technology for Advanced Packaging and Heterogeneous System-in-Package (SiP) integration.
  • Major Challenge 4: Extend world leadership in Semiconductor Equipment, Materials and Manufacturing solutions.
Long-term vision
  • New computing paradigms (‘Beyond CMOS’).
  • Process technology, equipment and materials.
  • Systems and components: architecture, design and integration.
  • Health & wellbeing.
  • Energy.
  • Digital Industry.
  • Transport and smart mobility.
  • Connectivity and interoperability.
  • Data science and Artificial Intelligence.

 

Para más información contacte con PTFOR.

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